The Relife RL 044 8 8P X A11 BGA stainless‑steel stencil enables precise reballing of A11-series CPUs on iPhone 8/8P/X platforms. Its half‑etch design and patented cooling holes ensure fast, accurate solder paste deposition.
Designed for professionals, the Relife RL 044 8 8P X A11 BGA stencil supports high-volume repair workflows with enhanced thermal control and repeatable performance.
Specifications – Relife RL 044 8 8P X A11 BGA
| Feature | Description |
|---|---|
| Stencil Model | RL 044 8 8P X A11 BGA |
| Material & Thickness | 0.12 mm high‑quality stainless steel (laser cut) |
| Etching Technique | Half‑etch process secures component fit, prevents board component burns |
| Cooling Design | Patented micro‑cooling holes for rapid heat dissipation |
| Hole Accuracy | Ultra‑precise round/square apertures, CNC/laser‑cut for clean solder paste release |
| Packaging | Double blister with hard-board card prevents deformation during transit |
| Compatible Devices | iPhone 8, 8 Plus, X with Apple A11 CPU/ICs reballing |
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