The Relife RL 044 HW8 BGA stencil is a precision 0.12 mm half-etched steel tool optimized for Kirin980/Hi3680 CPU BGA reballing. Essential for professional mobile repair workflows.
Specifications – Relife RL 044 HW8 BGA
| Feature | Description |
|---|---|
| Model | Relife RL 044 HW8 BGA |
| Material & Thickness | High-grade stainless steel, 0.12 mm thickness with half‑etch process |
| Target CPUs | HiSilicon Kirin980 / Hi3680 series |
| Compatible Models | Huawei Mate20/20X/20Pro/20RS/MateX, Honor V20/Magic2 |
| Hole Design | Ultra-precise round and square apertures for accurate solder ball placement |
| Etching Process | Half‑etch to allow component fit and protect adjacent parts |
| Cooling Holes | Patented cooling hole design for rapid heat dissipation |
| Packaging | Blister sealed in hardboard to prevent deformation |
| Use Case | Ideal for BGA reballing of mobile CPUs, GPU chips, and chipset repairs on Huawei/Honor devices |
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