The Relife RL 044 HU3 BGA high-precision stencil is engineered for reballing Huawei HI-series CPUs (e.g., HI6260, HI3680). Its 0.12 mm stainless steel half‑etch profile ensures accurate solder deposition with component safety.
Tailored to professional service centers and wholesalers, the Relife RL 044 HU3 BGA enhances repair efficiency through optimized thermal control and consistent ball placement.
Specifications – Relife RL 044 HU3 BGA
| Feature | Description |
|---|---|
| Model Number | RL 044 HU3 BGA |
| Material & Thickness | 0.12 mm laser-cut stainless steel for durability and precision |
| Etching Design | Half‑etch process allows component relief, preventing heat damage |
| Cooling Features | Patented micro‑cooling holes for fast heat dissipation |
| Hole Accuracy | Ultra‑precise CNC‑grade round/square apertures ensure even solder paste flow and release |
| Compatible CPUs | Huawei HI6260 B/A, HI3670 B/A, HI3680 B/A series |
| Packaging | Double-blister card packaging prevents deformation during shipping |
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