The Baku BA 100g Soldering Wire is designed for professional mobile repair and electronic assembly, providing reliable solder performance with excellent wetting and clean joints.

Specifications Baku BA 100g soldering wire

• 100 g spool with common diameters (e.g. 0.4 mm) for fine electronics and mobile board repair
• Lead-free alloy (Sn97% / Ag 0.3% / Cu 0.7%) with melting point ~217–225 °C, offering low-temperature soldering and high thermal stability
• High wettability, minimal residue, and steady solder flow under rework conditions
• No-clean flux core (2% flux) for clean joints without extra cleaning steps
• Suitable for mobile phone PCB, component leads, and delicate electronic repairs