The Relife RL 444 Solder Wire is engineered for professional mobile repair and microelectronics work, offering consistent solder flow and strong, clean joints for delicate circuitry.

Specifications Relife RL 444 solder wire

• Wire composition: lead‑free alloy (Sn / Ag / Cu) for safe, RoHS‑compliant repairs
• Flux core: no‑clean flux (approx. 2 %) to reduce residue and avoid extra cleaning steps
• Melting range: ~217‑225 °C for reliable performance under typical rework temperatures
• Diameter options (e.g. 0.3 mm, 0.4 mm, 0.5 mm) suited for fine-pitch components and mobile PCBs
• Ideal for mobile phone motherboard repair, component soldering, BGA rework, and precision electronics