The Relife RL 559 IM flux paste is a high-activity soldering flux developed for precise mobile phone PCB, BGA, and SMD repair, ensuring clean connections and superior solder flow.
Specifications Relife RL 559 im flux paste
- High activity for excellent solder adhesion
- No-clean, low-residue formula
- Non-corrosive and non-conductive
- Stable under high temperatures
- Ideal for BGA reballing and micro-soldering
- Compatible with leaded and lead-free solder
- Ensures fast tinning and clean, reliable joints
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