The Baku BK-223 solder flux is a professional-grade flux paste developed for mobile phone motherboard repair, BGA reballing and precision SMD work. Its high-viscosity and no-clean composition ensures reliable joints and minimal cleaning requirement.

Specifications Baku BK 223 solder flux

This flux features a high-viscosity formulation which allows controlled application in rework environments, particularly suited for BGA, CGA and CSP packages. The strong activity ensures effective oxide removal and improved solder wetting, making it appropriate for chip-level repairs and mobile-device motherboard work.

It is a no-clean type paste so residues are minimal and non-corrosive, reducing the need for post-solder cleaning. The composition includes synthetic resin, organic acids, corrosion inhibitors and solvents designed for mobile-repair uses. Packaging is available in syringe format (10 cc) making it convenient for technician usage.