The Relife RL-428-OR flux paste is a high-performance soldering flux designed for professional mobile phone motherboard and BGA rework applications. It features a halogen-free, high-viscosity formula that ensures strong adhesion and minimal residue, providing reliable and clean solder joints.

Specifications Relife RL 428 or flux paste

• Composition: Japanese-imported rosin for purity and consistency.
• Type: Halogen-free, no-clean soldering flux paste.
• Viscosity: High viscosity for precise application in BGA and SMD rework.
• Insulation Resistance: High insulation resistance suitable for mobile motherboard and CPU repairs.
• Residue: Minimal residue post-soldering, reducing the need for additional cleaning.
• Packaging: 100g container for professional use.
• Applications: Ideal for PCB soldering, BGA reballing, and general mobile device repairs.