The Relife RL-421S-OR flux paste is a high-viscosity, lead-free soldering flux designed for mobile phone PCB and BGA rework applications. It features high activity, easy tinning, and no virtual welding, ensuring reliable and efficient soldering processes.

Specifications Relife RL 421s or flux paste

• Composition: High-quality alloyed powder and resinic pasty flux
• Type: No-clean, lead-free soldering flux paste
• Viscosity: High viscosity for precise application in BGA and SMD rework
• Insulation Resistance: High insulation resistance suitable for mobile phone PCB and CPU repairs
• Residue: Minimal residue post-soldering, reducing the need for additional cleaning
• Packaging: 10cc syringe with ergonomic push-type design
• Applications: Ideal for BGA reballing, component tinning, and general PCB soldering