The Relife F-20 flux paste is a high-performance soldering flux designed for mobile phone PCB, BGA, and SMD repairs. It features a lead-free, no-clean formula that ensures excellent wettability, minimal smoke, and high insulation resistance, making it ideal for professional mobile repair applications.

Specifications Relife F 20 flux paste

• Composition: Hydrogenated rosin-based flux
• Type: No-clean, lead-free soldering flux
• Packaging: 10cc syringe with ergonomic push-type design
• Viscosity: Optimal for precise application in BGA and SMD rework
• Smoke Emission: Low smoke during soldering, ensuring a clean workspace
• Odor: Minimal, non-irritating odor for user comfort
• Storage: Recommended storage temperature between 5°C and 30°C
• Applications: Suitable for BGA reballing, component tinning, and general PCB soldering