The Baku BA-230 solder flux is a professional-grade flux designed for mobile phone motherboard repair, SMT/BGA rework and other high-density soldering applications. It combines excellent wetting, minimal residue and robust insulation performance.

Specifications Baku BA 230 solder flux

This flux is formulated with a halogen-free, lead-free-friendly chemistry that delivers strong solder adhesion and efficient flow even in high-density mobile PCB environments. The no-clean composition means minimal post-soldering cleaning is required, helping streamline service workflows and reduce turnaround time.

With exceptionally high insulation resistance and virtually non-conductive residue, the Baku BA-230 solder flux minimizes risk of electrical faults such as leakage or short circuits. The recommended storage temperature is 5-10 °C and the typical package size is 40 mL.