The Relife RL 044 HI1 BGA is a professional-grade, 0.12 mm steel stencil designed specifically for accurate BGA reballing of Huawei HI power CPU chips.
Engineered for mobile repair centers, BGA specialists, and parts wholesalers, the Relife RL 044 HI1 BGA features half-etch grooves, patented cooling-hole layout, and robust packaging to support precision rework workflows.
Specifications – Relife RL 044 HI1 BGA
| Feature | Description |
|---|---|
| Material | High-quality 0.12 mm steel, CNC laser-cut |
| Target Chip | Huawei HI Power CPU BGA |
| Etching Process | Half-etch design to protect solder ball integrity |
| Cooling Holes | Patented pattern for rapid heat dissipation during reflow |
| Hole Geometry | Precise round & square apertures for smooth solder ball placement |
| Durability | High-temp resistant, anti-fatigue steel resists deformation |
| Packaging | Double blister pack with rigid backing for protection |
| Thickness | 0.12 mm |
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