Relife RL 044 HI1 BGA
REQUEST A WHOLESALE PRICE QUOTE
This product is available for wholesale orders. Price is provided upon request based on quantity and destination.
- Minimum order: 10 units
- Volume discounts available for larger quantities
- Fast response — we reply within business hours
- Mix different models and products in one order
SAMPLE ORDER POLICY
Minimum sample order value is $300 USD. You can mix different models and products (Samsung, iPhone, and other items from our website) in one order.
- Mixed models allowed
- Perfect for testing quality before bulk order
- Best way for new wholesale clients
Why Wholesale Buyers Choose Us
Factory Direct
China Wholesale Pricing
15+ Years Experience
Specialized in mobile phone parts since 2009.
50+ Countries
Products exported worldwide.
Strict Quality Control
100% tested before shipment.
Fast Shipping
Stable delivery with global shipping.
Professional Support
Quick response within 24 hours.
The Relife RL 044 HI1 BGA is a professional-grade, 0.12 mm steel stencil designed specifically for accurate BGA reballing of Huawei HI power CPU chips.
Engineered for mobile repair centers, BGA specialists, and parts wholesalers, the Relife RL 044 HI1 BGA features half-etch grooves, patented cooling-hole layout, and robust packaging to support precision rework workflows.
Specifications – Relife RL 044 HI1 BGA
| Feature | Description |
|---|---|
| Material | High-quality 0.12 mm steel, CNC laser-cut |
| Target Chip | Huawei HI Power CPU BGA |
| Etching Process | Half-etch design to protect solder ball integrity |
| Cooling Holes | Patented pattern for rapid heat dissipation during reflow |
| Hole Geometry | Precise round & square apertures for smooth solder ball placement |
| Durability | High-temp resistant, anti-fatigue steel resists deformation |
| Packaging | Double blister pack with rigid backing for protection |
| Thickness | 0.12 mm |
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