Relife RL 044 1 BGA reballing stencil is designed for precise IC chip alignment during BGA rework. Built for durability and thermal stability, it supports consistent soldering results for professional mobile technicians.
Ideal for service centers and repair specialists, the Relife RL 044 1 BGA offers dependable performance for reballing specific device ICs with high accuracy.
Specifications – Relife RL 044 1 BGA
| Feature | Description |
|---|---|
| Product Name | Relife RL 044 1 BGA |
| Application | BGA reballing stencil for IC chip alignment |
| Material | High-quality stainless steel |
| Compatibility | Designed for specific mobile IC models |
| Thermal Resistance | Withstands repeated high-temperature soldering |
| Precision Level | Laser-cut for accurate ball placement |
| Use Case | Ideal for professional mobile repair and rework |
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