The Relife RL 044 HW2 BGA stencil is a precision-engineered 0.12 mm steel tool designed for efficient BGA reballing on mobile CPUs and chipsets. Ideal for repair professionals.
Specifications – Relife RL 044 HW2 BGA
| Feature | Description |
|---|---|
| Model | Relife RL 044 HW2 BGA |
| Thickness | 0.12 mm high‑precision stainless steel |
| Chip Compatibility | Supports wide range of mobile CPUs/BGA packages (HW2 series) |
| Hole Design | Ultra-precise round and square apertures for optimal solder ball placement |
| Etching Process | Half-etch technology for component protection and easy stencil removal |
| Cooling | Integrated cooling holes for rapid dissipation and temperature control |
| Packaging | Blister-sealed in hardboard envelope to prevent deformation |
| Use Cases | Ideal for BGA reballing, GPU/CPU repair, and precision solder mask applications |
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