The Baku BA 227 solder flux is a high-performance flux designed for precise and efficient mobile phone repair and rework applications.
Specifications Baku BA 227 solder flux
- Removes oxidation and improves solder adhesion
- Suitable for leaded and lead-free soldering
- Non-corrosive and non-conductive formula
- Stable under high temperature conditions
- Ideal for BGA reballing and IC replacement
- Provides clean finish with minimal residue
- Ensures reliable electrical connections
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