The Relife RL 044 M3 BGA precision stencil delivers reliable BGA reballing accuracy and improved thermal safety for mobile motherboard components. Ideal for professional service centers and parts wholesalers.
Engineered for high-volume mobile repair, the Relife RL 044 M3 BGA stencil enhances productivity with superior design and performance.
Specifications – Relife RL 044 M3 BGA
| Feature | Description |
|---|---|
| Stencil Thickness | 0.12 mm stainless steel for precise solder paste placement |
| Etching Technique | Half‑etch process allowing component relief to prevent burns |
| Cooling Design | Patented micro‑cooling holes for rapid heat dissipation during reflow |
| Hole Accuracy | Laser‑cut round/square apertures ensure consistent solder paste deposition |
| Packaging | Double‑blister, rigid card protection to prevent deformation |
| Weight | ~10–25 g depending on model configuration (M3 variant mid‑range) |
| Compatible Devices | Mobile CPU/BGA IC rework: iPhone 7–iPhone 16 series, Spreadtrum/MTK/Qualcomm chipsets |
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