Relife RL 044 7G 7P BGA reballing stencil is specifically engineered for accurate IC chip reballing on iPhone 7G and 7P logic boards. It ensures optimal alignment and stability during soldering, ideal for precision repairs.
Trusted by mobile service centers, the Relife RL 044 7G 7P BGA stencil supports high-efficiency rework with durable, heat-resistant stainless steel construction.
Specifications – Relife RL 044 7G 7P BGA
| Feature | Description |
|---|---|
| Product Name | Relife RL 044 7G 7P BGA |
| Application | IC chip reballing stencil for iPhone 7G / 7P |
| Material | High-grade stainless steel |
| Device Compatibility | Apple iPhone 7G and 7P logic board ICs |
| Precision | Laser-cut holes for exact solder ball placement |
| Thermal Resistance | Designed to withstand high rework temperatures |
| Ideal Users | Mobile repair technicians and service centers |
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