Relife RL 044 7G 7P BGA
REQUEST A WHOLESALE PRICE QUOTE
This product is available for wholesale orders. Price is provided upon request based on quantity and destination.
- Minimum order: 10 units
- Volume discounts available for larger quantities
- Fast response — we reply within business hours
- Mix different models and products in one order
SAMPLE ORDER POLICY
Minimum sample order value is $300 USD. You can mix different models and products (Samsung, iPhone, and other items from our website) in one order.
- Mixed models allowed
- Perfect for testing quality before bulk order
- Best way for new wholesale clients
Why Wholesale Buyers Choose Us
Factory Direct
China Wholesale Pricing
15+ Years Experience
Specialized in mobile phone parts since 2009.
50+ Countries
Products exported worldwide.
Strict Quality Control
100% tested before shipment.
Fast Shipping
Stable delivery with global shipping.
Professional Support
Quick response within 24 hours.
Relife RL 044 7G 7P BGA reballing stencil is specifically engineered for accurate IC chip reballing on iPhone 7G and 7P logic boards. It ensures optimal alignment and stability during soldering, ideal for precision repairs.
Trusted by mobile service centers, the Relife RL 044 7G 7P BGA stencil supports high-efficiency rework with durable, heat-resistant stainless steel construction.
Specifications – Relife RL 044 7G 7P BGA
| Feature | Description |
|---|---|
| Product Name | Relife RL 044 7G 7P BGA |
| Application | IC chip reballing stencil for iPhone 7G / 7P |
| Material | High-grade stainless steel |
| Device Compatibility | Apple iPhone 7G and 7P logic board ICs |
| Precision | Laser-cut holes for exact solder ball placement |
| Thermal Resistance | Designed to withstand high rework temperatures |
| Ideal Users | Mobile repair technicians and service centers |
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