The Relife RL 044 6S 6SP BGA is a professional-grade, ultra-precise 0.12 mm steel stencil engineered for accurate BGA reballing on iPhone 6S and 6SP CPU and baseband ICs.
Tailored for mobile service centers, technicians, and parts wholesalers, the Relife RL 044 6S 6SP BGA ensures heat-resistant performance, smooth solder flow, and rapid component reballing.
Specifications – Relife RL 044 6S 6SP BGA
| Feature | Description |
|---|---|
| Material | High‑quality steel, CNC laser‑cut, 0.12 mm thickness |
| Target Devices | iPhone 6S / 6SP CPU, baseband, Wi‑Fi, NFC BGA pads |
| Hole Design | Ultra‑precise round & square holes for even solder ball alignment |
| Etching Process | Half‑etch technique embeds components to prevent heat damage |
| Heat Management | Patented cooling holes accelerate heat dissipation, reduce burns |
| Durability | Scratch‑resistant, anti‑fatigue metal resists deformation |
| Packaging | Blister‑sealed with rigid backing to protect stencil integrity |
| Weight | ~10–25 g depending on variant |
| Compatibility | Also supports CPU/BGA reballs for broader iPhone/Mobile models |
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