BETA Electronic Co LTD

BETA Electronic Co LTD

BETA Electronic Co LTD

Relife RL 044 6S 6SP BGA

Grow Your Repair Business with Factory Direct Supply

We help repair shops and distributors grow with high-quality products, stable supply, and the most competitive wholesale prices.

SKU: BETA-48571
Wholesale Supplier for Professional Repair Shops & Distributors
Factory Direct Price
100% Tested Before Shipment
Bulk Discount for Wholesalers
Worldwide Shipping
Professional After-Sales Support
MOQ: 10 Units | Fast Order (2–7 Days)

REQUEST A WHOLESALE PRICE QUOTE

This product is available for wholesale orders. Price is provided upon request based on quantity and destination.

  • Minimum order: 10 units
  • Volume discounts available for larger quantities
  • Fast response — we reply within business hours
  • Mix different models and products in one order

SAMPLE ORDER POLICY

Minimum sample order value is $300 USD. You can mix different models and products (Samsung, iPhone, and other items from our website) in one order.

  • Mixed models allowed
  • Perfect for testing quality before bulk order
  • Best way for new wholesale clients

Why Wholesale Buyers Choose Us

Factory Direct

China Wholesale Pricing

15+ Years Experience

Specialized in mobile phone parts since 2009.

50+ Countries

Products exported worldwide.

Strict Quality Control

100% tested before shipment.

Fast Shipping

Stable delivery with global shipping.

Professional Support

Quick response within 24 hours.

The Relife RL 044 6S 6SP BGA is a professional-grade, ultra-precise 0.12 mm steel stencil engineered for accurate BGA reballing on iPhone 6S and 6SP CPU and baseband ICs.

Tailored for mobile service centers, technicians, and parts wholesalers, the Relife RL 044 6S 6SP BGA ensures heat-resistant performance, smooth solder flow, and rapid component reballing.

Specifications – Relife RL 044 6S 6SP BGA

Feature Description
Material High‑quality steel, CNC laser‑cut, 0.12 mm thickness
Target Devices iPhone 6S / 6SP CPU, baseband, Wi‑Fi, NFC BGA pads
Hole Design Ultra‑precise round & square holes for even solder ball alignment
Etching Process Half‑etch technique embeds components to prevent heat damage
Heat Management Patented cooling holes accelerate heat dissipation, reduce burns
Durability Scratch‑resistant, anti‑fatigue metal resists deformation
Packaging Blister‑sealed with rigid backing to protect stencil integrity
Weight ~10–25 g depending on variant
Compatibility Also supports CPU/BGA reballs for broader iPhone/Mobile models

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Shipping Worldwide Section

We Ship Worldwide

Honduras
Ecuador
Colombia
Peru
Chile
Mexico

Ready to Grow Your Wholesale Business?

Contact us now and get the best wholesale price for your bulk order today!

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Official Invoice

For all bulk orders

100% Tested

Before shipment

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Products

Relife RL 044 6S 6SP BGA
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