The Relife RL 044 6S 6SP A9 BGA stencil is engineered for professional mobile repair – offering ultra-fine 0.12 mm laser-etched alignment for precise A9 chip reballing on iPhone 6S/6SP boards.
Specifications – Relife RL 044 6S 6SP A9 BGA
| Feature | Description |
|---|---|
| Model | Relife RL 044 6S 6SP A9 BGA stencil |
| Compatibility | Designed specifically for iPhone 6S & 6SP A9 BGA chips |
| Material | Imported high-grade stainless steel |
| Thickness | 0.12 mm laser-etched stencil for optimal solder deposition |
| Etching Process | Half-etch design preventing component heat damage |
| Thermal Features | Patented cooling holes for rapid heat dissipation |
| Hole Precision | Round-square apertures for smooth de-masking and alignment |
| Packaging | Durable double-blister + hard paper case protection |
| Application | BGA reballing of A9 chips during motherboard-level repairs |
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