The Relife RL 044 6G 6P BGA precision stencil is designed for exact reballing of iPhone 6/6P A8-series CPUs. Its 0.12 mm stainless-steel build, half-etch process, and patented cooling holes ensure efficient solder paste deposition while protecting nearby components.
Crafted for high-efficiency professional service centers and wholesalers, the Relife RL 044 6G 6P BGA enhances repair throughput with consistent accuracy and thermal control.
Specifications – Relife RL 044 6G 6P BGA
| Feature | Description |
|---|---|
| Model | RL 044 6G 6P BGA |
| Material & Thickness | 0.12 mm stainless steel, laser‑cut for durability and precision |
| Etching Process | Half‑etch technique allows component clearance, reducing heat exposure |
| Cooling Design | Patented micro‑holes enable rapid heat dissipation during reflow |
| Hole Geometry | Precision round/square apertures ensure even paste release and cleaner operation |
| Packaging | Double‑blister with rigid card to prevent deformation during shipping |
| Compatibility | iPhone 6 / 6 Plus (A8 CPU series) |
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