BETA Electronic Co LTD

BETA Electronic Co LTD

BETA Electronic Co LTD

Relife RL 044 6G 6P A8 BGA

Grow Your Repair Business with Factory Direct Supply

We help repair shops and distributors grow with high-quality products, stable supply, and the most competitive wholesale prices.

SKU: BETA-48580
Wholesale Supplier for Professional Repair Shops & Distributors
Factory Direct Price
100% Tested Before Shipment
Bulk Discount for Wholesalers
Worldwide Shipping
Professional After-Sales Support
MOQ: 10 Units | Fast Order (2–7 Days)

REQUEST A WHOLESALE PRICE QUOTE

This product is available for wholesale orders. Price is provided upon request based on quantity and destination.

  • Minimum order: 10 units
  • Volume discounts available for larger quantities
  • Fast response — we reply within business hours
  • Mix different models and products in one order

SAMPLE ORDER POLICY

Minimum sample order value is $300 USD. You can mix different models and products (Samsung, iPhone, and other items from our website) in one order.

  • Mixed models allowed
  • Perfect for testing quality before bulk order
  • Best way for new wholesale clients

Why Wholesale Buyers Choose Us

Factory Direct

China Wholesale Pricing

15+ Years Experience

Specialized in mobile phone parts since 2009.

50+ Countries

Products exported worldwide.

Strict Quality Control

100% tested before shipment.

Fast Shipping

Stable delivery with global shipping.

Professional Support

Quick response within 24 hours.

The Relife RL 044 6G 6P A8 BGA is a professional-grade, CNC laser-cut 0.12 mm steel stencil engineered for flawless BGA reballing of A8 CPU chips on iPhone 6G and 6P motherboards.

Designed for mobile repair centers, BGA service specialists, and parts wholesalers, the Relife RL 044 6G 6P A8 BGA features cooling holes, half-etch process, and premium packaging for high-precision, repeatable rework workflows.

Specifications – Relife RL 044 6G 6P A8 BGA

Feature Description
Material High-quality 0.12 mm steel, CNC laser-cut
Compatibility iPhone 6G / 6P A8 CPU BGA pads
Etching Process Half-etch design for component protection
Cooling Holes Patented layout for rapid heat dissipation
Hole Precision Ultra-precise round & square apertures for smooth stencil removal
Durability High-temp resistant steel, anti-fatigue, scratch-resistant
Packaging Double blister pack with hard backing to prevent bending
Thickness 0.12 mm

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Shipping Worldwide Section

We Ship Worldwide

Honduras
Ecuador
Colombia
Peru
Chile
Mexico

Ready to Grow Your Wholesale Business?

Contact us now and get the best wholesale price for your bulk order today!

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Secure Packaging

Safe and strong packing

Official Invoice

For all bulk orders

100% Tested

Before shipment

Secure Payment

T/T, PayPal, Western Union

Products

Relife RL 044 6G 6P A8 BGA
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