The Relife RL 044 6G 6P A8 BGA is a professional-grade, CNC laser-cut 0.12 mm steel stencil engineered for flawless BGA reballing of A8 CPU chips on iPhone 6G and 6P motherboards.
Designed for mobile repair centers, BGA service specialists, and parts wholesalers, the Relife RL 044 6G 6P A8 BGA features cooling holes, half-etch process, and premium packaging for high-precision, repeatable rework workflows.
Specifications – Relife RL 044 6G 6P A8 BGA
| Feature | Description |
|---|---|
| Material | High-quality 0.12 mm steel, CNC laser-cut |
| Compatibility | iPhone 6G / 6P A8 CPU BGA pads |
| Etching Process | Half-etch design for component protection |
| Cooling Holes | Patented layout for rapid heat dissipation |
| Hole Precision | Ultra-precise round & square apertures for smooth stencil removal |
| Durability | High-temp resistant steel, anti-fatigue, scratch-resistant |
| Packaging | Double blister pack with hard backing to prevent bending |
| Thickness | 0.12 mm |
No schema found.
Reviews
There are no reviews yet.