The Relife RL 044 HW1 BGA nozzle provides high-precision hot-air delivery for safe and efficient mobile phone BGA chip rework. Trusted tool for professionals.
Specifications – Relife RL 044 HW1 BGA
| Feature | Description |
|---|---|
| Compatibility | Works with standard hot-air stations (e.g., Hakko, Quick, Aoyue) supporting HW1 style nozzles |
| Nozzle Shape | Rectangular profile optimized for BGA chip packages |
| Nozzle Size | 44 mm × 44 mm opening for chip sizes up to 50 mm |
| Material | High-grade stainless steel with heat-resistant coating |
| Temperature Resistance | Stable up to 450 °C; avoids heat bleed to surrounding components |
| Installation | Slide-on HW1 interface; secures firmly without tools |
| Use Case | Ideal for BGA solder removal, reflow, chip-level diagnostics and repairs |
| Durability | Industrial-grade; rated for hundreds of repair cycles |
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