Relife RL 044 HW1 BGA
REQUEST A WHOLESALE PRICE QUOTE
This product is available for wholesale orders. Price is provided upon request based on quantity and destination.
- Minimum order: 10 units
- Volume discounts available for larger quantities
- Fast response — we reply within business hours
- Mix different models and products in one order
SAMPLE ORDER POLICY
Minimum sample order value is $300 USD. You can mix different models and products (Samsung, iPhone, and other items from our website) in one order.
- Mixed models allowed
- Perfect for testing quality before bulk order
- Best way for new wholesale clients
Why Wholesale Buyers Choose Us
Factory Direct
China Wholesale Pricing
15+ Years Experience
Specialized in mobile phone parts since 2009.
50+ Countries
Products exported worldwide.
Strict Quality Control
100% tested before shipment.
Fast Shipping
Stable delivery with global shipping.
Professional Support
Quick response within 24 hours.
The Relife RL 044 HW1 BGA nozzle provides high-precision hot-air delivery for safe and efficient mobile phone BGA chip rework. Trusted tool for professionals.
Specifications – Relife RL 044 HW1 BGA
| Feature | Description |
|---|---|
| Compatibility | Works with standard hot-air stations (e.g., Hakko, Quick, Aoyue) supporting HW1 style nozzles |
| Nozzle Shape | Rectangular profile optimized for BGA chip packages |
| Nozzle Size | 44 mm × 44 mm opening for chip sizes up to 50 mm |
| Material | High-grade stainless steel with heat-resistant coating |
| Temperature Resistance | Stable up to 450 °C; avoids heat bleed to surrounding components |
| Installation | Slide-on HW1 interface; secures firmly without tools |
| Use Case | Ideal for BGA solder removal, reflow, chip-level diagnostics and repairs |
| Durability | Industrial-grade; rated for hundreds of repair cycles |
We Ship Worldwide
Safe and strong packing
For all bulk orders
Before shipment
T/T, PayPal, Western Union
Reviews
There are no reviews yet.