The Relife RL 044 EMMC EMCP BGA stencil offers mobile technicians and repair centers a premium solution for accurate, repeatable tin planting on EMMC, EMCP and NAND chips. Designed for industrial-grade BGA reballing efficiency.
Specifications – Relife RL 044 EMMC EMCP BGA
| Feature | Description |
|---|---|
| Model | Relife RL 044 EMMC EMCP BGA stencil |
| Material | 0.12 mm stainless steel / high-quality special steel—laser etched |
| Thickness | Standard 0.12 mm; variants include 0.15 mm (OT2/NAND) |
| Compatibility | EMMC, EMCP, NAND, UFS, LPDDR chips; supports multiple BGA pitch formats (e.g., BGA60–BGA297) |
| Etching | Half-etch process ensuring clean, burr-free apertures |
| Tolerance | ±0.02 mm alignment accuracy (laser precision) |
| Weight | Approx. 5 g per stencil (net); gross weight ~30 g |
| Application | BGA reballing for chip replacement or repair on mobile devices |
| Compliance | RoHS-free; meets industrial stencil quality standards |
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