The Baku BA 229 Solder Flux is a high-performance soldering compound designed to deliver efficient, clean, and reliable results in mobile phone repair, PCB assembly, and component rework operations.

Specifications Baku BA 229 solder flux

Baku BA 229 Solder Flux ensures superior solder wetting and strong adhesion, producing durable joints across various soldering applications including BGA, SMD, and fine-pitch components. Its advanced anti-oxidation formulation maintains stability under high heat, promoting consistent solder flow and preventing bridging or cold joints. The flux enhances heat transfer efficiency, making it ideal for precision repair environments and continuous use in professional workshops.

Engineered for clean operation, Baku BA 229 Solder Flux leaves minimal residue and is non-corrosive, ensuring easy post-solder cleaning and long-term board reliability. Its smooth texture allows for precise and controlled application, reducing waste and improving overall workflow. Perfect for service centers and experienced technicians, it supports high-quality, consistent soldering performance in all types of electronic and mobile repair work.