{"id":126963,"date":"2024-01-30T06:38:51","date_gmt":"2024-01-30T06:38:51","guid":{"rendered":"https:\/\/mobilerepairparts.com\/product\/relife-rl-044-hi1-bga\/"},"modified":"2026-04-19T06:10:11","modified_gmt":"2025-07-17T13:14:20","slug":"relife-rl-044-hi1-bga","status":"publish","type":"product","link":"https:\/\/mobilerepairparts.com\/pt-br\/product\/relife-rl-044-hi1-bga\/","title":{"rendered":"Relife RL 044 HI1 BGA"},"content":{"rendered":"<p>O <strong>Relife RL 044 HI1 BGA<\/strong> \u00e9 um est\u00eancil de a\u00e7o de 0,12 mm de qualidade profissional, projetado especificamente para o reballing preciso de BGA de chips de CPU de pot\u00eancia HI da Huawei.<\/p>\n<p>Projetado para centros de reparos m\u00f3veis, especialistas em BGA e atacadistas de pe\u00e7as, o Relife RL 044 HI1 BGA apresenta ranhuras de meia busca, layout patenteado de orif\u00edcio de resfriamento e embalagem robusta para suportar fluxos de trabalho de retrabalho de precis\u00e3o.<\/p>\n<h2>Especifica\u00e7\u00f5es &#8211; Relife RL 044 HI1 BGA<\/h2>\n<table>\n<thead>\n<tr>\n<th>Recurso<\/th>\n<th>Descri\u00e7\u00e3o<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Material <\/td>\n<td>A\u00e7o de alta qualidade de 0,12 mm, cortado a laser por CNC<\/td>\n<\/tr>\n<tr>\n<td>Chip de destino<\/td>\n<td>CPU BGA de alta pot\u00eancia da Huawei<\/td>\n<\/tr>\n<tr>\n<td>Processo de grava\u00e7\u00e3o<\/td>\n<td>Projeto de meia grava\u00e7\u00e3o para proteger a integridade da esfera de solda<\/td>\n<\/tr>\n<tr>\n<td> Orif\u00edciosde resfriamento<\/td>\n<td> Padr\u00e3opatenteado para r\u00e1pida dissipa\u00e7\u00e3o de calor durante o refluxo<\/td>\n<\/tr>\n<tr>\n<td> Geometriado furo<\/td>\n<td> Aberturas redondas e quadradas precisas para coloca\u00e7\u00e3o suave da esfera de solda<\/td>\n<\/tr>\n<tr>\n<td>Durabilidade<\/td>\n<td>O a\u00e7o resistente a altas temperaturas e antifadiga resiste \u00e0 deforma\u00e7\u00e3o<\/td>\n<\/tr>\n<tr>\n<td>Embalagem<\/td>\n<td> Embalagem blisterdupla com suporte r\u00edgido para prote\u00e7\u00e3o<\/td>\n<\/tr>\n<tr>\n<td>Espessura<\/td>\n<td>0.12\u202fmm<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"excerpt":{"rendered":"<p data-start=\"5\" data-end=\"77\"><span class=\"relative -mx-px my-[-0.2rem] rounded px-px py-[0.2rem] transition-colors duration-100 ease-in-out\">RelifeRL044 HI1BGA &#8211; Est\u00eancil de a\u00e7o de precis\u00e3o de 0,12 mm para reballing de BGA de CPU de pot\u00eancia HI da Huawei com orif\u00edcios de resfriamento e design half-etch.<\/span><\/p>\n","protected":false},"featured_media":99953,"comment_status":"open","ping_status":"closed","template":"","meta":[],"product_brand":[],"product_cat":[2892],"product_tag":[],"class_list":["post-126963","product","type-product","status-publish","has-post-thumbnail","product_cat-outros","first","instock","shipping-taxable","product-type-simple"],"_links":{"self":[{"href":"https:\/\/mobilerepairparts.com\/pt-br\/wp-json\/wp\/v2\/product\/126963","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/mobilerepairparts.com\/pt-br\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/mobilerepairparts.com\/pt-br\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/mobilerepairparts.com\/pt-br\/wp-json\/wp\/v2\/comments?post=126963"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/mobilerepairparts.com\/pt-br\/wp-json\/wp\/v2\/media\/99953"}],"wp:attachment":[{"href":"https:\/\/mobilerepairparts.com\/pt-br\/wp-json\/wp\/v2\/media?parent=126963"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/mobilerepairparts.com\/pt-br\/wp-json\/wp\/v2\/product_brand?post=126963"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/mobilerepairparts.com\/pt-br\/wp-json\/wp\/v2\/product_cat?post=126963"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/mobilerepairparts.com\/pt-br\/wp-json\/wp\/v2\/product_tag?post=126963"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}