{"id":126924,"date":"2024-01-30T06:51:31","date_gmt":"2024-01-30T06:51:31","guid":{"rendered":"https:\/\/mobilerepairparts.com\/product\/relife-rl-044-hw8-bga\/"},"modified":"2026-04-19T06:10:11","modified_gmt":"2025-07-16T16:06:00","slug":"relife-rl-044-hw8-bga","status":"publish","type":"product","link":"https:\/\/mobilerepairparts.com\/pt-br\/product\/relife-rl-044-hw8-bga\/","title":{"rendered":"Relife RL 044 HW8 BGA"},"content":{"rendered":"<p>O est\u00eancil Relife RL 044 HW8 BGA \u00e9 uma ferramenta de precis\u00e3o de 0,12 mm em a\u00e7o semi-destacado, otimizada para reballing de BGA de CPU Kirin980\/Hi3680. Essencial para fluxos de trabalho profissionais de reparos m\u00f3veis. <\/p>\n<h2>Especifica\u00e7\u00f5es &#8211; Relife RL 044 HW8 BGA<\/h2>\n<table>\n<thead>\n<tr>\n<th>Recurso<\/th>\n<th>Descri\u00e7\u00e3o<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Modelo <\/td>\n<td>Relife RL 044 HW8 BGA<\/td>\n<\/tr>\n<tr>\n<td>Material &amp; Espessura<\/td>\n<td>A\u00e7o inoxid\u00e1vel de alta qualidade, espessura de 0,12 mm com processo half-etch<\/td>\n<\/tr>\n<tr>\n<td>CPUs de destino<\/td>\n<td>S\u00e9rie HiSilicon Kirin980 \/ Hi3680<\/td>\n<\/tr>\n<tr>\n<td>Modelos compat\u00edveis<\/td>\n<td>Huawei Mate20\/20X\/20Pro\/20RS\/MateX, Honor V20\/Magic2<\/td>\n<\/tr>\n<tr>\n<td>Hole Design <\/td>\n<td>Aberturas redondas e quadradas ultraprecisas para coloca\u00e7\u00e3o precisa da esfera de solda<\/td>\n<\/tr>\n<tr>\n<td>Processo de grava\u00e7\u00e3o <\/td>\n<td>Meia grava\u00e7\u00e3o para permitir o ajuste do componente e proteger as pe\u00e7as adjacentes<\/td>\n<\/tr>\n<tr>\n<td>Orif\u00edcios de resfriamento<\/td>\n<td>Design patenteado de orif\u00edcio de resfriamento para r\u00e1pida dissipa\u00e7\u00e3o de calor<\/td>\n<\/tr>\n<tr>\n<td>Embalagem<\/td>\n<td>Blister selado em papel\u00e3o r\u00edgido para evitar deforma\u00e7\u00f5es<\/td>\n<\/tr>\n<tr>\n<td>Caso de uso <\/td>\n<td>Ideal para reballing BGA de CPUs m\u00f3veis, chips de GPU e reparos de chipset em dispositivos Huawei\/Honor<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"excerpt":{"rendered":"<p data-start=\"0\" data-end=\"150\">Relife RL 044 HW8 BGA &#8211; est\u00eancil de precis\u00e3o de 0,12 mm para reballing de BGA de CPU Kirin980\/Hi3680 em reparos de placas-m\u00e3e m\u00f3veis.<\/p>\n","protected":false},"featured_media":99981,"comment_status":"open","ping_status":"closed","template":"","meta":[],"product_brand":[],"product_cat":[2892],"product_tag":[],"class_list":["post-126924","product","type-product","status-publish","has-post-thumbnail","product_cat-outros","first","instock","shipping-taxable","product-type-simple"],"_links":{"self":[{"href":"https:\/\/mobilerepairparts.com\/pt-br\/wp-json\/wp\/v2\/product\/126924","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/mobilerepairparts.com\/pt-br\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/mobilerepairparts.com\/pt-br\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/mobilerepairparts.com\/pt-br\/wp-json\/wp\/v2\/comments?post=126924"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/mobilerepairparts.com\/pt-br\/wp-json\/wp\/v2\/media\/99981"}],"wp:attachment":[{"href":"https:\/\/mobilerepairparts.com\/pt-br\/wp-json\/wp\/v2\/media?parent=126924"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/mobilerepairparts.com\/pt-br\/wp-json\/wp\/v2\/product_brand?post=126924"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/mobilerepairparts.com\/pt-br\/wp-json\/wp\/v2\/product_cat?post=126924"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/mobilerepairparts.com\/pt-br\/wp-json\/wp\/v2\/product_tag?post=126924"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}