{"id":154491,"date":"2024-01-30T06:38:51","date_gmt":"2024-01-30T06:38:51","guid":{"rendered":"https:\/\/mobilerepairparts.com\/product\/relife-rl-044-hi1-bga\/"},"modified":"2026-04-19T06:10:11","modified_gmt":"2025-07-17T13:13:11","slug":"relife-rl-044-hi1-bga","status":"publish","type":"product","link":"https:\/\/mobilerepairparts.com\/es\/product\/relife-rl-044-hi1-bga\/","title":{"rendered":"Relife RL 044 HI1 BGA"},"content":{"rendered":"<p>La <strong>Relife RL 044 HI1 BGA<\/strong> es una plantilla de acero de 0,12mm de calidad profesional dise\u00f1ada espec\u00edficamente para el reballing BGA preciso de chips de CPU de potencia HI de Huawei.<\/p>\n<p>Dise\u00f1ada para centros de reparaci\u00f3n m\u00f3viles, especialistas en BGA y mayoristas de piezas, la BGA Relife RL 044 HI1 cuenta con ranuras de medio grabado, una disposici\u00f3n patentada de los orificios de refrigeraci\u00f3n y un embalaje robusto para soportar flujos de trabajo de retrabajo de precisi\u00f3n.<\/p>\n<h2>Especificaciones &#8211; Relife RL 044 HI1 BGA<\/h2>\n<table>\n<thead>\n<tr>\n<th>Funci\u00f3n<\/th>\n<th>Descripci\u00f3n<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Material<\/td>\n<td>Acero de alta calidad de 0,12 mm, cortado con l\u00e1ser CNC<\/td>\n<\/tr>\n<tr>\n<td>Chipde destino<\/td>\n<td>Huawei HI Power CPU BGA<\/td>\n<\/tr>\n<tr>\n<td>Proceso de grabado<\/td>\n<td>Dise\u00f1o de medio grabado para proteger la integridad de la bola de soldadura<\/td>\n<\/tr>\n<tr>\n<td>Orificios de refrigeraci\u00f3n<\/td>\n<td>Patr\u00f3n patentado para una r\u00e1pida disipaci\u00f3n del calor durante el reflujo<\/td>\n<\/tr>\n<tr>\n<td>Geometr\u00eda del orificio<\/td>\n<td>Redondo preciso &amp; aperturas cuadradas para una colocaci\u00f3n suave de la bola de soldadura<\/td>\n<\/tr>\n<tr>\n<td>Durabilidad<\/td>\n<td> Acero resistente a altas temperaturas y antifatiga que resiste la deformaci\u00f3n<\/td>\n<\/tr>\n<tr>\n<td>Envase<\/td>\n<td>Doble bl\u00edster con soporte r\u00edgido para su protecci\u00f3n<\/td>\n<\/tr>\n<tr>\n<td>Thickness<\/td>\n<td>0.12\u202fmm<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"excerpt":{"rendered":"<p data-start=\"5\" data-end=\"77\"><span class=\"relative -mx-px my-[-0.2rem] rounded px-px py-[0.2rem] transition-colors duration-100 ease-in-out\">RelifeRL044 HI1BGA &#8211; Plantilla de acero de precisi\u00f3n de 0,12mm para reballing de BGA de CPU de potencia HI de Huawei con orificios de refrigeraci\u00f3n y dise\u00f1o de medio orificio.<\/span><\/p>\n","protected":false},"featured_media":99954,"comment_status":"open","ping_status":"closed","template":"","meta":[],"product_brand":[],"product_cat":[2914],"product_tag":[],"class_list":["post-154491","product","type-product","status-publish","has-post-thumbnail","product_cat-otros","first","instock","shipping-taxable","product-type-simple"],"_links":{"self":[{"href":"https:\/\/mobilerepairparts.com\/es\/wp-json\/wp\/v2\/product\/154491","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/mobilerepairparts.com\/es\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/mobilerepairparts.com\/es\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/mobilerepairparts.com\/es\/wp-json\/wp\/v2\/comments?post=154491"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/mobilerepairparts.com\/es\/wp-json\/wp\/v2\/media\/99954"}],"wp:attachment":[{"href":"https:\/\/mobilerepairparts.com\/es\/wp-json\/wp\/v2\/media?parent=154491"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/mobilerepairparts.com\/es\/wp-json\/wp\/v2\/product_brand?post=154491"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/mobilerepairparts.com\/es\/wp-json\/wp\/v2\/product_cat?post=154491"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/mobilerepairparts.com\/es\/wp-json\/wp\/v2\/product_tag?post=154491"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}